Cov kev taw qhia ntawm cov pob zeb diamond micro hmoov zoo suav nrog cov khoom loj me me, cov duab particle, purity, lub cev muaj zog thiab lwm yam, uas cuam tshuam ncaj qha rau nws cov txiaj ntsig hauv kev lag luam sib txawv (xws li polishing, sib tsoo, txiav, thiab lwm yam). Cov hauv qab no yog cov kev qhia tseem ceeb thiab cov kev xav tau txheeb xyuas los ntawm cov txiaj ntsig kev tshawb fawb dav dav:
Particle loj faib thiab characterization parameter
1. Particle loj ntau yam
Qhov loj me me ntawm pob zeb diamond micro hmoov feem ntau yog 0.1-50 microns, thiab qhov yuav tsum tau ua rau particle loj sib txawv heev hauv cov ntawv thov sib txawv.
Polishing: Xaiv 0-0.5 micron rau 6-12 micron ntawm cov hmoov micron kom txo tau khawb thiab txhim kho nto 5
Sib Tsoo: Micro-hmoov li ntawm 5-10 microns mus rau 12-22 microns yog qhov tsim nyog rau kev ua haujlwm zoo thiab qhov zoo.
Kev sib tsoo zoo: 20-30 micron hmoov tuaj yeem txhim kho kev sib tsoo
2. Particle loj faib characterization
D10: qhov sib thooj particle loj ntawm 10% ntawm cov khoom faib tawm, qhia txog qhov sib piv ntawm cov khoom zoo. Qhov kev faib ua feem ntawm cov khoom zoo yuav tsum tau tswj kom tsis txhob txo qhov kev sib tsoo efficiency.
D50 (qhov nruab nrab txoj kab uas hla): sawv cev rau qhov nruab nrab particle loj, uas yog lub ntsiab parameter ntawm particle loj faib thiab ncaj qha cuam tshuam rau kev ua hauj lwm efficiency thiab raug.
D95: qhov sib thooj particle loj ntawm 95% sib faib faib, thiab tswj cov ntsiab lus ntawm coarse hais (xws li D95 tshaj tus qauv yog yooj yim ua rau khawb ntawm workpieces).
Mv (ntim nruab nrab qhov loj me): cuam tshuam los ntawm cov khoom loj thiab siv los ntsuas qhov ntxhib kawg faib
3. Cov txheej txheem txheem
Cov qauv thoob ntiaj teb feem ntau siv suav nrog ANSI (xws li D50, D100) thiab ISO (xws li ISO6106: 2016).
Thib ob, particle puab thiab nto yam ntxwv
1. Cov duab tsis zoo
Roundness: qhov ze ntawm qhov sib npaug yog rau 1, qhov ntau kheej kheej cov khoom yog thiab qhov zoo dua cov nyhuv polishing; hais nrog qis roundness (ntau lub ces kaum) yog qhov tsim nyog rau electroplating hlau saws thiab lwm yam scenes uas xav tau cov npoo ntse.
Plate-zoo li hais: hais nrog transmittance> 90% yog suav tias yog phaj zoo li, thiab qhov kev faib ua feem yuav tsum tsawg tshaj li 10%; Cov phaj zoo li ntau dhau yuav ua rau muaj qhov sib txawv ntawm qhov ntsuas qhov loj me thiab tsis ruaj khov ntawm daim ntawv thov.
Bead-zoo li hais: qhov ntev mus rau qhov dav piv ntawm cov khoom> 3: 1 yuav tsum tau tswj nruj me ntsis, thiab qhov kev faib ua feem yuav tsum tsis pub tshaj 3%.
2. Txoj kev kuaj pom zoo
Optical microscope: haum rau kev soj ntsuam cov khoom saum toj 2 microns
Scanning electron microscope (SEM): siv rau kev soj ntsuam morphology ntawm ultrafine hais nyob rau theem nanometer.
Purity thiab impurity tswj
1. Cov ntsiab lus impurity
Pob zeb diamond purity yuav tsum> 99%, thiab hlau impurities (xws li hlau, tooj liab) thiab cov khoom tsis zoo (sulfur, chlorine) yuav tsum nruj me ntsis tswj hauv qab 1%.
Sib nqus impurities yuav tsum tsawg kom tsis txhob muaj cov nyhuv ntawm agglomeration ntawm precision polishing.
2. Sib nqus susceptibility
High purity pob zeb diamond yuav tsum nyob ze rau cov uas tsis yog-sib nqus, thiab siab magnetic susceptibility qhia cov residual hlau impurities, uas yuav tsum tau kuaj los ntawm electromagnetic induction txoj kev.
Lub cev ua tau zoo ntsuas
1. cuam tshuam toughness
Lub crushing tsis kam ntawm cov khoom yog tus cwj pwm los ntawm tus nqi tsis sib xws (los yog lub sij hawm tawg ib nrab) tom qab kev sim cuam tshuam, uas cuam tshuam ncaj qha rau lub zog ntawm cov cuab yeej sib tsoo.
2. Thermal stability
Cov hmoov zoo yuav tsum muaj kev ruaj ntseg ntawm qhov kub thiab txias (xws li 750-1000 ℃) kom tsis txhob muaj graphite tsim lossis oxidation uas ua rau lub zog txo; Feem ntau siv cov ntsuas ntsuas ntsuas ntsuas ntsuas (TGA).
3. Microhardness
Lub microhardness ntawm pob zeb diamond hmoov yog mus txog 10000 kq / mm2, yog li nws yog ib qho tsim nyog los xyuas kom meej lub zog particle muaj zog los tswj kev txiav.
Daim ntawv thov adaptability yuav tsum 238
1. Sib npaug ntawm particle loj tis thiab ua cov nyhuv
Cov khoom ntxhib (xws li siab D95) txhim kho kev sib tsoo zoo tab sis txo qhov ua kom tiav: cov khoom zoo (me me D10) muaj qhov cuam tshuam. Kho qhov kev faib tawm raws li qhov yuav tsum tau ua.
2. Kev hloov pauv zoo
Thaiv multi-ntug hais yog haum rau resin sib tsoo log; spherical hais yog haum rau precision polishing.
Cov kev sim thiab cov qauv
1. Particle loj nrhiav tau
Laser diffraction: dav siv rau micron / submicron hais, ua haujlwm yooj yim thiab txhim khu kev qha cov ntaub ntawv;
Txoj kev Sieve: tsuas yog siv tau rau cov khoom siab tshaj 40 microns;
2. Kev kuaj pom zoo
Particle duab analyzer tuaj yeem txheeb xyuas qhov tsis xws li kev sib tw thiab txo qhov yuam kev ntawm kev soj ntsuam;
ua sum
High-zoo pob zeb diamond micro-hmoov yuav tsum muaj kev tswj hwm particle loj tis (D10/D50/D95), particle shape (roundness, flake or needle content), purity (impurities, magnetic properties), thiab lub cev (lub zog, thermal stability). Cov neeg tsim khoom yuav tsum ua kom zoo dua qhov ntsuas raws li cov xwm txheej tshwj xeeb thiab ua kom zoo ib yam los ntawm txoj kev xws li laser diffraction thiab electron microscopy. Thaum xaiv, cov neeg siv yuav tsum xav txog kev ua haujlwm tshwj xeeb (xws li kev ua tau zoo thiab ua tiav) thiab ua kom haum cov ntsuas raws li. Piv txwv li, precision polishing yuav tsum ua ntej tswj hwm D95 thiab roundness, thaum sib tsoo ntxhib tuaj yeem ua kom cov duab xav tau los txhim kho kev ua haujlwm.
Cov ntsiab lus saum toj no yog excerpted los ntawm superhard cov ntaub ntawv network.
Post lub sij hawm: Jun-11-2025
